2022 IEEE International Conference on Acoustics, Speech and Signal Processing

7-13 May 2022
  • Virtual (all paper presentations)
22-27 May 2022
  • Main Venue: Marina Bay Sands Expo & Convention Center, Singapore
  • Satellite Venue: Shenzhen, China (Postponed)


SPS Travel Grants

ICASSP 2022 will have its main venue in Singapore, and a satellite venue in Shenzhen, China for in-person participation, in addition to a full virtual conference. Are you an author in need of travel support to attend ICASSP 2022 in-person? If so, we have an opportunity for you!

The IEEE Signal Processing Society (SPS) is pleased to provide travel grants on a highly competitive basis to student and non-student authors. The grants will be awarded to a limited number of applicants who have a genuine need for support, and the paper quality will be taken into consideration. All grantees must meet the following eligibility requirements to be considered:

The China satellite venue is set up for delegates who are already in China to participate without crossing the quarantine border. Therefore, the grantees must already be in China before the conference.

The travel grants can be used to attend the physical conference to cover the travel expenses including airfare, accommodations, and conference registration fees for approved applicants to attend ICASSP 2022. The travel grant, if approved, will be on a reimbursement basis following instructions given to grantees for those who attend the physical conference. If you are only attending the virtual conference, you will not be eligible for the travel grant. The SPS travel grant selection and oversight committees reserve the right to make the final decision regarding all applications.

Full details and important information can be found on the SPS Current Travel Grants and SPS Travel Grants Q&A pages.

APPLICATION DEADLINE – 2 February @ 12:00 PM (noon) ET Late applications will not be accepted.

SPS Travel Grant Applications are not yet open. Check back later.

Apply for the grant by clicking here.